Binder is expanding its existing M8 portfolio with redesigned 360° shielded cable connectors, minimising electromagnetic ...
A Peter Thiel backed startup called Substrate is reported to have raised $100 million to take on ASML in the litho tool ...
GigaDevice has received IEC 61508 SC3 (SIL 2/SIL 3) functional safety certification for the software test libraries of a pair of Cortex-M33 MCU series. “With growing emphasis on safety across ...
University College London (UCL) is opening a Space Enterprise Lab (SEL) in IDEALondon. This is the innovation hub and workspace run by UCL Engineering and WilbeLAB. And the new lab is part of a joint ...
The development of glass-based substrates for electronics in data centers and high-performance computing is the aim of a consortium gathered by German research institute Fraunhofer IZM (Fraunhofer ...
The NASP platform employs trained neural networks in the analogue domain to perform AI inference with much lower power ...
Nordic Semi is supporting Bluetooth Channel Sounding using its open source Android app. The nRF Toolbox app completes Nordic’s end-to-end Bluetooth Channel Sounding offering and is suitable for ...
The European Space Agency (ESA) is looking to establish a presence in Tokyo to strengthen strategic partnerships with the Japanese space industry. ESA says it will now have staff permanently working ...
The US, Argentina and Australia are in the top of the global meat-eating league with more than 110 kg consumed per capita in 2022, according to the World Population Review. Countries where more than ...
Read the first ever Electronics Weekly online: 7th September 1960. We've scanned the very first edition so you can enjoy it.
Direct Insight is to offer KaRo’s 27 x 27mm system on module that pairs a 1.2GHz dual-core Arm Cortex-A35 processor with 1Gbyte of LPDDR4, 4Gbyte of eMMC flash and an NPU.
The three aerospace companies Airbus, Leonardo, Thales are joining forces to pool space exploration and Earth observation capabilities for a new European space company. According to a Memorandum of ...
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